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Eagle ETS-364 Test Head Adapter             < back to Direct Dock Wafer Probing Interfaces
 
  Eagle ETS-364 Test Head Adapter
  Teradyne Catalyst Tower
  Credence ASL3000
  Teradyne J750
 

Side view of adapter showing modules and test head mounting flange.

Adapter can be used for both package parts and wafer level testing.

Tester side of Eagle ETS-364 test head adapter.

DUT side of Eagle ETS-364 test head adapter.


If you want complete flexibility to test wafers and packaged parts with your Eagle test system, inTEST has the answer!

We’ve developed a modular test head adapter for the Eagle ETS-364 test system that makes it ideal for mixed-signal applications and allows you to use all your tester resources right at the device. You get the best possible performance and the shortest path to the DUT.

The adapter eliminates the need for a secondary electrical interface on the test head, so you get superior signal transmission for all your testing, from wafer-level testing to package testing.

The adapter can be permanently mounted on the ETS-364 test head. That lets you efficiently use your test system for wafer test, hand test, and high-volume package test with a handler or strip test system – with remarkably fast and easy changeovers from wafer test to package test.

An optional hand-test adapter allows a socketed DUT board to be used with the tower. This lets your test system use the same electrical interface both for wafer probing and for volume package testing with a handler. Using the same interface across all set-ups should increase correlation and improve overall test satisfaction.


Each of the unit’s 8 signal modules provides 16 high-speed, 50-ohm signal paths; 126 user-defined pins; and 36 utility pins. Combined, the 8 modules provide 128 high-speed, 50-ohm signal paths; 1,008 user-defined pins; and 288 utility pins.

The adapter’s large, 12”-diameter probe card design gives you plenty of applications space for additional components, vertical probe heads, or space transformers.

For probe-only applications, this interface is available as a top-loading interface, with a vertical hinged mechanism to allow easy changeover of the probe card.



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